1. Suzhou Chengshi Electronic., Ltd founded in 1997, specialized in the RF ceramic components’ international trade business with the “SCSE” as the abbreviation and brand name.
2. The company devotes to the Ceramic Antenna/ Filter/Ceramic duplexer/ High power Terminator/Attenuator Research and Design since 2003
3. The company changed the name to “Suzhou New Chengshi Electronic., Ltd” in Jun of 2006, focused on the Ceramic components from the RD to manufacturing with the whole process.
4. The company invested the Electro-plating production lines and started into mass production successfully in 2012, the capacity and capability included the Ni、Ag、Cu、Au、Sn plating and etc.
5. The company was honored as the “Ceramic Engineering RD center” in 2013
6. The company was certified as the “National High-tech Enterprise” in 2015
7. The Company focused on the new field of thin-film technology and invested the thin-film production line in 2018, achieved the complete process for the metallization from Thick-film to Thin-Film and electro-plating on the Ceramic surface
8. The company developed the ceramic semiconductor hybrid circuit components with the advantage of High Frequency/High thermal Conductivity/small size/multiple function integrated in 2019.
9. The new plant (24000squ meter) was constructed in 2020, which included three buildings respective for the RD center、manufacturing and process assembly.
2. The company devotes to the Ceramic Antenna/ Filter/Ceramic duplexer/ High power Terminator/Attenuator Research and Design since 2003
3. The company changed the name to “Suzhou New Chengshi Electronic., Ltd” in Jun of 2006, focused on the Ceramic components from the RD to manufacturing with the whole process.
4. The company invested the Electro-plating production lines and started into mass production successfully in 2012, the capacity and capability included the Ni、Ag、Cu、Au、Sn plating and etc.
5. The company was honored as the “Ceramic Engineering RD center” in 2013
6. The company was certified as the “National High-tech Enterprise” in 2015
7. The Company focused on the new field of thin-film technology and invested the thin-film production line in 2018, achieved the complete process for the metallization from Thick-film to Thin-Film and electro-plating on the Ceramic surface
8. The company developed the ceramic semiconductor hybrid circuit components with the advantage of High Frequency/High thermal Conductivity/small size/multiple function integrated in 2019.
9. The new plant (24000squ meter) was constructed in 2020, which included three buildings respective for the RD center、manufacturing and process assembly.